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Case Studies
  Home > About Mindteck > Case Studies
  Code optimization for ESAU ASIC SmartSet module
About The Customer
The customer is a world leader in touch screen technology with presence in the U.S, Europe and Asia Pacific.

The Challenge
The challenge was in providing undiminished functionality with a smaller silicon footprint.

The Solution

The system was redesigned and implemented in assembly with a smaller silicon footprint. For this purpose, the code was studied thoroughly and the team came up with ways and means of optimizing the code. Sections of the code which could be optimized were identified and re-designed. The team was able to reduce the footprint by around 35%. The new code was completely regression tested to ensure that the existing functionality was not affected.

The Benefits
By reducing the silicon footprint, more features were added to the product without changing the original bill of materials (BOM).

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